Discuss sourcing raw materials for photoresists (PR) and polyimides (PI), resin monomers, photoacid generator (PAG) related compounds, and fluorene and anthracene derivatives. Candidates are checked against the application, chemical structure and required specifications.
This page covers raw materials. It does not guarantee the availability or performance of finished photoresists, PI films or formulated materials.
Raw material categories
Resin monomers
Examples include adamantyl, cyclopentyl and cyclohexyl methacrylates, and norbornane lactone related raw materials. We review sourcing feasibility based on your required chemical structure and application.
Photoresist (PR) monomers
Examples include methacrylates with hydroxyl groups or lactone structures, and fluorinated monomers. We review candidate materials and sourcing feasibility based on your required chemical structure and process.
Polyimide (PI) related raw materials
Examples include aromatic and alicyclic tetracarboxylic dianhydrides and aromatic diamines. We review candidates and sourcing feasibility for the required chemical structure, including cyclobutane-based types, biphenyl or benzophenone skeletons, and ether linkages.
Photoacid generators (PAGs) and related raw materials
Examples of related raw materials include sulfonium salts, iodonium salts and imide compounds. We review sourcing feasibility based on your required chemical structure, specifications and handling conditions.
Fluorene derivatives
Examples include bisphenol, hydroxyethoxy, glycidyl, allyl, amino and acrylate types. We review candidate materials and sourcing feasibility based on your required functional groups and application.
Anthracene derivatives and other raw materials for electronic materials
In addition to anthracenecarboxylic acid, anthracene methacrylates and carbazole compounds, you can discuss benzotriazole-related raw materials and N-methyl-2-pyrrolidone (NMP). For materials not listed, we review sourcing feasibility against the chemical structure, application and required specifications.
Application-Based Enquiry Examples
These examples draw on general applications of the material groups. They do not imply that every listed raw material is suitable for each use or guarantees a particular performance or process compatibility.
PI film and electronic-material resin development
Discuss dianhydride and diamine candidates when developing polyimide films or resins for electronic materials. We review target heat resistance, transparency or dimensional stability and clarify structural, purity and impurity requirements. Target performance must be assessed for the resin combination and manufacturing and evaluation conditions.
Formulations for copper and copper-alloy corrosion control
Benzotriazole is generally used to inhibit corrosion of copper and its alloys. For metal-protection formulations or treatment liquids, we review the target metal, formulation liquid and required purity to identify candidates. Dosage and effectiveness require evaluation under the actual formulation and operating conditions.
Resin dissolution and process-solvent selection
NMP is a raw material considered for resin dissolution and process-solvent applications. We review the resin to be dissolved, process step, moisture and impurity limits, and storage and handling conditions to check sourcing against the required specification. Review the SDS and workplace-specific safety controls before use.
Information for selection and evaluation
Please specify the chemical name, CAS number or structure, application and process, purity, limits for impurities, metals, ions and moisture, analytical methods, packaging, storage, SDS, quantity and target delivery date. Specifications and test methods vary by material.
Samples, documentation, minimum quantities, price, lead time and import/export or transport feasibility are subject to individual confirmation. Suitability for electronic materials and performance in production must be evaluated under your own conditions.